Sputtering Target Backing Plate

Copper Alloy Sputtering Target Backing Plates

(Blanks or Finished) out of:

C18150 Copper Chrome Zirconium, C17510 Copper Nickel Beryllium, and a Beryllium Free option C18000 Copper Nickel Silicon Chromium.

Copper alloy  backing plates are an essential component  in the field of sputtering of thin film depositions, particularly in the production of semiconductors and display devices.

 These plates are typically manufactured  from copper, copper alloy, stainless steel, molybdenum, or tungsten. The main purpose of these backing plates is to provide a stable support for the sputtering target material, ensuring uniformity and consistency during the sputtering process.

 Copper  alloys  are often  chosen as the ideal material because they offer high thermal conductivity with optimum mechanical stability. These copper alloy high conductivity backing plates   aid in heat dissipation, preventing overheating issues that can affect the efficiency of sputtering systems.   

Cadi Company, Inc., as a target supplier offers made-from-print custom targets made of high-quality copper alloys such as C18150 Copper Chrome Zirconium, C17510 Copper Nickel Beryllium, and a Beryllium Free option C18000 Copper Nickel Silicon Chromium.